PFP 302-3M, 2 Part Epoxy (Packages)

PRODUCT DESCRIPTION

The PFP 302-3M, a versatile, dual-component epoxy from Precision Fiber Products, Inc., stands out with its specific design for optical, fiber optic, and semiconductor applications. Exhibiting exceptional versatility, this product enhances adhesive joining to ensure a robust bond and assists in sealing to create airtight connections. Moreover, it effectively functions in potting applications to safeguard against shock and vibration, and it can also serve as a protective coating.

PRODUCT EQUIVALENT

This product is equivalent to the following companies item:

• FOCenter: ET302-3M-XXXX
• EPO-TEK®: 302-3M

PFP 302-3M ADVANTAGES & SUGGESTED APPLICATION NOTES

• Low viscosity, clear and colorless epoxy is well suited for potting applications, and for transmitting VIS or NIR light in opto-circuits
• Excellent water, chemical, and solvent resistant properties including 10% nitric acid, acetone, hexane, and dicholormethane
• Fiber Optic/Optical:
    1. Potting and encapsulation; lens and prism bonding for Scientific / OEM instruments; LED encapsulant
    2. Transmission in the VIS/NIR range from 350 – 1550 nm. Can be used in the optical pathway
    3. Potting or sealing the fiber into the snout of the opto-package
    4. Adhesive for V-groove, fiber arrays or lens arrays
    5. Bonding optical fibers into ferrules. Fibers of glass or plastic. Ferrules of glass, quartz, stainless steel, kovar, or ceramic
• Semiconductor:
   Recommended for underfilling of flip chips or SMDs on PCB; can also be used for COB glob top process using a DAM/FILL method; can resist 85/85 moisture soaks, as well as Tcycles and Tshocks