MicroCare MicroWipe™ High-Purity Circuit Lint-Free Wipes - 300 sheets/bag Bag, 300sheets/bag In a Case of 12 bags
These wipes are the most favored flat wipe for stencil cleaning. These wipes are designed with a hydroentagled interlocking of a sturdy, absorbant polymer. 10 times cleaner than standard stencil wipes. These cleaning wipes are more powerful, product less lint, absorb more paste and produce more consistent cleaning. In some applications these fibers are powerful enough to clean without the aide of solvents. This greatly rises fine pitch yields while decreasing costs.
Many advantages are produced by this new paper technology. Finer cleaning averts a source of solder paste contamination, with less defects and fewer rework than older types of stencil wipes. Improved cleaning speeds the cleaning process, rises throughput and cuts back paper consumption.
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